Any effect on a design due to temperature could be simulated with FEA thermal analysis. Stress, strain and deflection induced in a design during temperature change (thermal expansion or compression) could be captured using Thermal stress analysis. Graphical illustration can clearly help identify the places of the stress induced due to thermal expansion or compression. The following figure shows the thermal deflection and thermal stress introduced during thermal loading of plate containing two different shell materials. While thermal distribution in a design due to heat transfer taking place by internal conduction, convection and radiation can be simulated with Transient or steady-state heat transfer analysis.